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| Authors: | Janusz Rudnicki: Instytut Radioelektroniki Politechniki Warszawskiej, Poland |
| | J. Piotr Starski: Chalmers University of Technology, Microwave Electronics, Sweden |
| Publication title: | FDTD analysis of multichip vertical interconnects |
| Conference: | GigaHertz 2003. Proceedings from the Seventh Symposium |
| Publication type: | Poster |
| Issue: | 008 |
| Article No.: | 077 |
| Abstract: | In this paper we present FDTD simulations for multichip interconnects between a CPW transmission line, CPW transmission line and a CPW chip (CPW-CPW-CPW) using metallic, spherical bumps. We show that the main influence on the performance of the entire CPW-CPW-CPW structure has the first level of interconnection, where the via holes are used. A reduction in return loss can be achieved by using small bump dimensions in the lower CPW-CPW interconnection. |
| Language: | English |
| Year: | 2003 |
| No. of pages: | 4 |
| Series: | Linköping Electronic Conference Proceedings |
| ISSN (print): | 1650-3686 |
| ISSN (online): | 1650-3740 |
| File: | http://www.ep.liu.se/ecp/008/posters/051/ecp00851p.pdf |
| Available: | 2003-11-06 |
| Publisher: | Linköping University Electronic Press, Linköpings universitet |
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