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Authors:Björn Petersson: Saab Bofors Dynamics, Sweden
Anders Sundberg: Saab Bofors Dynamics, Sweden
Publication title:Circuit-board mounting using double-sided adhesive tape
Conference:GigaHertz 2003. Proceedings from the Seventh Symposium
Publication type: Poster
Article No.:076
Abstract:In this paper, a method of using double-sided adhesive tape when mounting microwave circuit-boards is discussed. In particular, one type of adhesive tape with good features is described. The tape-mounting is simple and fast to use and it is cheap. The tape that was used is soft and it can handle both high and low temperatures. These two features make the tape useful in places where parts with different thermal expansion coefficients are mounted together. The tape will absorb the shear forces that could otherwise damage for example substrates made of brittle materials like Aluminium-oxide.

When substrates are mounted with tape, a cavity is created under the substrate. The cavity may have potential resonating frequencies within the frequency band of interest. If a bond wire transition between different substrates is used, the cavity resonance may lead to undesirable reflections. The problem can be addressed in different ways. Two methods will be briefly discussed in this paper: coplanar wave-guide-transitions and a “phase-cancelling” technique. Results from simulations and prototype card measurements are presented. The primary frequency range is the X-band (8-12 GHz).

No. of pages:4
Series:Linköping Electronic Conference Proceedings
ISSN (print):1650-3686
ISSN (online):1650-3740
Publisher:Linköping University Electronic Press, Linköpings universitet

Björn Petersson, Anders Sundberg (2003). Circuit-board mounting using double-sided adhesive tape, GigaHertz 2003. Proceedings from the Seventh Symposium;article=076 (accessed 4/16/2014)