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| Authors: | Erik Öjefors: Uppsala University, Dep. of Engineering Sciences, Sweden |
| | Anders Rydberg: Uppsala University, Dep. of Engineering Sciences, Sweden |
| Publication title: | LTCC and glob-top packaging for 24 GHz MMICs with integrated antennas |
| Conference: | GigaHertz 2003. Proceedings from the Seventh Symposium |
| Publication type: | Abstract and Fulltext |
| Issue: | 008 |
| Article No.: | 022 |
| Abstract: | A packaging method for low cost 24 GHz MMIC:s with on chip antenna using LTCC carrier substrates and glob-top encapsulation is evaluated. Microstrip ring resonators are used for characterization of single and double layers of Ferro A6-S LTCC material at 24 GHz. Quality factors close to 100 are obtained, and good agreement with the manufacturers data is demonstrated. Five different commercial glob-top, side-fill and cavity fill materials are used to cover the LTCC ring resonators. Measurements show only minor degradation in resonator quality factor when glob-tops are applied, thus indicating low dielectric losses in the encapsulation material. |
| Language: | English |
| Year: | 2003 |
| No. of pages: | 4 |
| Series: | Linköping Electronic Conference Proceedings |
| ISSN (print): | 1650-3686 |
| ISSN (online): | 1650-3740 |
| File: | http://www.ep.liu.se/ecp/008/022/ecp00822.pdf |
| Available: | 2003-11-06 |
| Publisher: | Linköping University Electronic Press, Linköpings universitet |
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