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Authors:Erik Öjefors: Uppsala University, Dep. of Engineering Sciences, Sweden
Anders Rydberg: Uppsala University, Dep. of Engineering Sciences, Sweden
Publication title:LTCC and glob-top packaging for 24 GHz MMICs with integrated antennas
Conference:GigaHertz 2003. Proceedings from the Seventh Symposium
Publication type: Abstract and Fulltext
Issue:008
Article No.:022
Abstract:A packaging method for low cost 24 GHz MMIC:s with on chip antenna using LTCC carrier substrates and glob-top encapsulation is evaluated. Microstrip ring resonators are used for characterization of single and double layers of Ferro A6-S LTCC material at 24 GHz. Quality factors close to 100 are obtained, and good agreement with the manufacturers data is demonstrated. Five different commercial glob-top, side-fill and cavity fill materials are used to cover the LTCC ring resonators. Measurements show only minor degradation in resonator quality factor when glob-tops are applied, thus indicating low dielectric losses in the encapsulation material.
Language:English
Year:2003
No. of pages:4
Series:Linköping Electronic Conference Proceedings
ISSN (print):1650-3686
ISSN (online):1650-3740
File:http://www.ep.liu.se/ecp/008/022/ecp00822.pdf
Available:2003-11-06
Publisher:Linköping University Electronic Press, Linköpings universitet

REFERENCE TO THIS PAGE
Erik Öjefors, Anders Rydberg (2003). LTCC and glob-top packaging for 24 GHz MMICs with integrated antennas, GigaHertz 2003. Proceedings from the Seventh Symposium http://www.ep.liu.se/ecp_article/index.en.aspx?issue=008;article=022 (accessed 8/27/2014)