Article | GigaHertz 2003. Proceedings from the Seventh Symposium | FDTD analysis of multichip vertical interconnects

Title:
FDTD analysis of multichip vertical interconnects
Author:
Janusz Rudnicki: Instytut Radioelektroniki Politechniki Warszawskiej, Poland J. Piotr Starski: Chalmers University of Technology, Microwave Electronics, Sweden
Download:
Full text (pdf)
Year:
2003
Conference:
GigaHertz 2003. Proceedings from the Seventh Symposium
Issue:
008
Article no.:
077
No. of pages:
4
Publication type:
Poster
Published:
2003-11-06
Series:
Linköping Electronic Conference Proceedings
ISSN (print):
1650-3686
ISSN (online):
1650-3740
Publisher:
Linköping University Electronic Press; Linköpings universitet


In this paper we present FDTD simulations for multichip interconnects between a CPW transmission line; CPW transmission line and a CPW chip (CPW-CPW-CPW) using metallic; spherical bumps. We show that the main influence on the performance of the entire CPW-CPW-CPW structure has the first level of interconnection; where the via holes are used. A reduction in return loss can be achieved by using small bump dimensions in the lower CPW-CPW interconnection.

GigaHertz 2003. Proceedings from the Seventh Symposium

Author:
Janusz Rudnicki, J. Piotr Starski
Title:
FDTD analysis of multichip vertical interconnects
References:

[1] ”QuickWave 3D Software Manual”; version 2.1; QWED; Poland; 2001


[2] J. P. Starski; J. Rudnicki; „Numerical Investigation of Flip Chip Connections using FDTD Simulations”; 3rd European Week; 2-6 October 2000; Paris; France


[3] J. P. Starski; J. Rudnicki; „Numerical Analysis of Conductive Adhesive Based Flip Chip Connections”; 9th Topical Meeting on Electrical Performance of Electrical Packaging EPEP 2000; 23-25 October 2000; Scottsdale; Arizona; USA


[4] J. Rudnicki; J. P. Starski; „Vertical interconnection for flip chip connection”; 14th International Conference on Microwaves; Radar and Wireless Communications; Poland; Gdansk; May 2002


[5] D. Staiculescu; J. Laskar; E. M. Tentzeris; „Design Rule Development for Microwave Flip-Chip Applications”; IEEE Trans. Microwave Theory Tech.; vol. 48; pp. 1476-1481; Sept. 2000.


[6] W. Heinrich; A. Jentzsch; H. Richter; „Flip-chip interconnects for frequencies up to W band”; Electronic Letters; vol. 37; pp. 180-181; Feb. 2001


[7] K. G. Heinen; W. H. Schoen; “Multichip assembly with flipped integrated circuits”; ”; IEEE Trans. Hybrids; Manufact. Technol.; vol. 12; no. 4; Dec. 1989

GigaHertz 2003. Proceedings from the Seventh Symposium

Author:
Janusz Rudnicki, J. Piotr Starski
Title:
FDTD analysis of multichip vertical interconnects
Note: the following are taken directly from CrossRef
Citations:
No citations available at the moment