Article | GigaHertz 2003. Proceedings from the Seventh Symposium | LTCC and glob-top packaging for 24 GHz MMICs with integrated antennas

Title:
LTCC and glob-top packaging for 24 GHz MMICs with integrated antennas
Author:
Erik Öjefors: Uppsala University, Dep. of Engineering Sciences, Sweden Anders Rydberg: Uppsala University, Dep. of Engineering Sciences, Sweden
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Full text (pdf)
Year:
2003
Conference:
GigaHertz 2003. Proceedings from the Seventh Symposium
Issue:
008
Article no.:
022
No. of pages:
4
Publication type:
Abstract and Fulltext
Published:
2003-11-06
Series:
Linköping Electronic Conference Proceedings
ISSN (print):
1650-3686
ISSN (online):
1650-3740
Publisher:
Linköping University Electronic Press; Linköpings universitet


A packaging method for low cost 24 GHz MMIC:s with on chip antenna using LTCC carrier substrates and glob-top encapsulation is evaluated. Microstrip ring resonators are used for characterization of single and double layers of Ferro A6-S LTCC material at 24 GHz. Quality factors close to 100 are obtained; and good agreement with the manufacturers data is demonstrated. Five different commercial glob-top; side-fill and cavity fill materials are used to cover the LTCC ring resonators. Measurements show only minor degradation in resonator quality factor when glob-tops are applied; thus indicating low dielectric losses in the encapsulation material.

GigaHertz 2003. Proceedings from the Seventh Symposium

Author:
Erik Öjefors, Anders Rydberg
Title:
LTCC and glob-top packaging for 24 GHz MMICs with integrated antennas
References:

[1] E. Öjefors; F. Bouchriha; K. Grenier and A. Rydberg; ”24 GHz ISM-band Antennas on Surface Micromachined Substrates for integration with a Commercial SiGe Process;” accepted for European Conference on Wireless Technology (ECWT); Munich; Germany; Oct. 2003.


[2] L. Li; B. Cook; and M. Veatch; “Measurement of RF properties of glob top and under-encapsulant materials;” in Proc. Electrical Performance of Electronic Packaging; Cambridge; MA; vol. I; pp. 121-124; Oct. 2001


[3] R. Sturdivant; C. Quan; and J. Wooldridge; “Investigation of MMIC Flip Chips with Sealants for Improved Reliability without Hermeticity;” in Proc. MTT-S Int. Microwave Symp.; San Francisco; CA; pp. 239-242; Jun. 1996


[4] R. Kulke; W. Simon; A. Lauer; M. Rittweger; P. Waldow; S. Stringfellow; R. Powell; M. Harrison; J-P. Bertinet; “Investigation of Ring Resonators on Multilayer LTCC;” MTT-S Int. Microwave Symp; Workshop on Ceramic Interconnect Technologies; Phoenix; AZ; May 2001

GigaHertz 2003. Proceedings from the Seventh Symposium

Author:
Erik Öjefors, Anders Rydberg
Title:
LTCC and glob-top packaging for 24 GHz MMICs with integrated antennas
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