A packaging method for low cost 24 GHz MMIC:s with on chip antenna using LTCC carrier substrates and glob-top encapsulation is evaluated. Microstrip ring resonators are used for characterization of single and double layers of Ferro A6-S LTCC material at 24 GHz. Quality factors close to 100 are obtained; and good agreement with the manufacturers data is demonstrated. Five different commercial glob-top; side-fill and cavity fill materials are used to cover the LTCC ring resonators. Measurements show only minor degradation in resonator quality factor when glob-tops are applied; thus indicating low dielectric losses in the encapsulation material.